SA56004X
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?NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7  25 February 2013
37 of 43
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
 
For further information on temperature profiles, refer to Application Note AN10365 
Surface mount reflow soldering description.
14. Soldering: PCB footprints
 
MSL: Moisture Sensitivity Level
Fig 24.   Temperature profiles for large and small components
mperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
 temperature
Fig 25.   PCB footprint for SOT96-1 (SO8); reflow soldering
sot096-1  fr
i
r
solder lands
Dim n i n  in mm
l    m n
r    ?nbsp .2
1.30
0.60 (8?
1.27 (6?
4.00   6.60
5.50
7.00
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